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02:41
The Day Trader With 11 Wins in a Row Opens a $11 Million Long Position on BTC, With a Take Profit Price of $60,500
BlockBeats News, June 30th, according to Hyperinsight monitoring, today on the Hyperliquid platform, the "BTC Largest Long Position Holder" is a short-term intraday trader with the address 0xa44. This address has achieved an 11-game winning streak during the recent volatile market, often engaging in large-scale intraday opening and closing. 1 hour ago, the trader opened a 184.3 BTC long position with 40x leverage, equivalent to $11 million, at an average price of $59,852, and has placed a take-profit order at $60,500.
02:38
Mitsubishi UFJ: The weakening of the yen may be due to fundamental factors
```htmlGolden Ten Data reported on June 30 that Mitsubishi UFJ Morgan Stanley Securities strategist Shota Ryu stated the main driver of the yen's weakness is Japan’s own fundamental issues, such as the continually expanding digital services trade deficit and the increasing overseas investments by domestic individuals and businesses. Ryu said speculators have built up large short positions on the yen in the futures market, indicating overheated trading. He added that this provides justification for the Japanese government to intervene in order to boost the yen. Japanese Finance Minister Katsuki Katayama said on Tuesday that the government is ready to take “decisive” action in the foreign exchange market when necessary.```
02:38
Applied Materials launches a series of 3D manufacturing devices for AI chips, targeting HBM stacking technology.
```htmlGolden Ten Data reported on June 30 that Applied Materials has unveiled a product line of three-dimensional (3D) chip manufacturing equipment designed for AI semiconductor applications. This series of equipment mainly focuses on flatness, deposition, and metrology detection required by advanced packaging processes such as high bandwidth memory (HBM), Chiplet, and Hybrid Bonding. Specifically, the newly announced equipment includes advanced Chemical Mechanical Polishing (CMP), Electrochemical Vapor Deposition (ECD), and Plasma-Enhanced Chemical Vapor Deposition (PECVD) devices for the packaging sector. It also introduces process control devices based on electron beams and upgrades its epitaxial equipment used for DRAM processes.```
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